Complete Teardown Report of Qualcomm's 60GHz WiGig/WiFi 802.11ad Chipset, 2018 Report

DUBLIN, Aug. 22, 2018 /PRNewswire/ --

Research and Markets

The "Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World's First Smartphone Edition Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering.

This report includes a full investigation of the system, featuring a detailed study of the SiPs and the antenna board including die analyses, processes and board cross-sections. It contains a complete cost analysis and a selling price estimation of the system. Finally, it features an exhaustive comparison with the Qualcomm QCA9500, which is dedicated to routers or mobile computers.

2018 is a turning point for 5G communications. All players have done several studies on huge data rates using millimeter wave (mmWave) compared to current technologies. Today, manufacturers are focusing on backhaul applications with high power and no voltage limitation. But the next steps - such as handset applications - are gaining attention as integration will have several issues to solve, including chip implementation, packaging technology, antennae placement and heat management. Using the 60GHz band, the IEEE has licensed a Wi-Fi 802.11 protocol, known as WiGig. Today, a few routers and only one commercially available smartphone use this protocol, providing an early glimpse of 5G mobile capability and using Qualcomm's chipset.

This complete solution has been designed for smartphones, especially for ASUS. The module, integrated in the ASUS ZenFone 4 Pro, comes with two systems linked by a coaxial connection. Both Systems-in-Packages (SiPs) use non-conventional double-sided molded packaging developed by Murata. One is integrated on the main board and the other features innovative antennae integrated into an organic PCB. The latter SiP integrates almost 20 antennae, a radio frequency integrated circuit (RFIC) die, thermal management and isolation solution, all in a single package smaller than 40mm.

Developed by Wilocity, which has been a Qualcomm subsidiary since 2014, the RFIC fea- tures up to four transceivers controlling up to 32 antennas, both patch and dipole, for beamforming at 60GHz. Both SiPs have very thin confined PCB substrates and embedded copper pillars realizing the signal distribution structure. This first integration of such a mmWave device in a handset shows the full compatibility of this SiP technology that could answer 5G integration issues.

Key Topics Covered:

1. Overview/Introduction

2. Company profile and WiGig technology

3. ASUS ZenFone 4 Pro Teardown

4. Market Analysis

5. Physical Analysis

• Physical analysis methodology
• Module analysis
• Main board and Antenna Board analysis
• Baseband and Antenna SiP analysis
• Package view and dimensions
• Package X-Ray: antennae placement and connection
• Package opening: copper pillar, bill of material
• Package cross-section: PCB, copper pillar, dimensions
• Package process analysis
• Die analysis: Baseband processor and RFIC
• Die analysis: Current and voltage regulator, memory
• Physical analysis comparison

6. Manufacturing process flow

• Die fabrication unit: Baseband processor, RFIC
• Packaging fabrication unit
• SiP package process flow

7. Cost Analysis

• Overview of the cost analysis
• Supply chain description
• Yield hypotheses
• Die cost analyses: Baseband processor, RFIC
• Baseband and Antenna SiP Package cost analysis
  

8. Estimated Price Analysis

Companies Mentioned

• Qualcomm

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