SUSS MicroTec Wafer Bonder Division Receives Supplier Excellence Award from Analog Devices

The award ceremony was held at the Shangri-La Hotel in Hong Kongon February, 14th. Michael Kipp, General Manager of the Wafer BondingDivision accepted the award on behalf of SUSS MicroTec. Other awardrecipients included Applied Materials, LAM Research and TSMC.

"SUSS MicroTec won this award for demonstrating excellent servicesupport for their automated production wafer bonding systems, andtheir people deserve recognition for going the extra mile to meet ourMEMS manufacturing needs" said Craig Core, Fab Manager, AnalogDevices' Micromachined Products Division. As a pioneer in themicromachine IC industry, Analog Devices is the leading supplier ofMEMS airbag sensors worldwide. The company's iMEMS(R) inertial sensortechnology is used in a wide range of automotive, consumer, andindustrial product applications.

"We are very honored to receive recognition for capital equipmentservice and support from a leader in the MEMS industry, such as AnalogDevices"; said Michael Kipp, General Manager, SUSS MicroTec WaferBonder Division. Dr. Amir Mirza, International Product Manager forWafer Bonders, SUSS MicroTec added "We recognize that service andsupport is an essential requirement of every MEMS manufacturer and asa business we strive to set the standard for performance."

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process andtest technology for the semiconductor industry. SUSS maintains itsleadership position with over 7,000 systems installed worldwide. SUSSproducts include coating developing systems, 1X full-field lithography(1XFFL) systems, substrate bonders, flip-chip bonders, probe systemsand now equipment for C4NP production. Headquartered in Munich,Germany, SUSS has 5 international manufacturing sites and providessupport from sales and service centers in North America, Europe, Asiaand Japan. For more information about SUSS MicroTec, please visitwww.suss.com.

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